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Deeprobe reduces the number of X-SEM inspection required, allowing for non destructive TSV and tench depth assessment. Deeprobe uses IR interferometric sensor for cavity depth measurement. Deeprobe is the perfect tool for Deep reactive ion etching process control.
Qualified and certified by IMEC
Technology
- Low coherence IR interferometry for step height measurement
(Patented)
Applications
- TSV: Via first, middle and last
- High A/R Deep tench depth measurement
- Deep Reactive Ion Etching process control
- Bulk micromachining process control
- Step height measurement
Benefits and Key features
- Non destructive technology
- Fast and easy to use
- CCD camera for spot positioning and pattern recognition
- Adjustable metrology spot size
- Calibration and maintenance free
Equipment
- Deepoint
Manual table top for R&D facilities
- Deeprobe 300M
Semi automatic tool
for 200 and 300 mm wafers
- Deeprobe 200A
Fully automated tool for 200 mm wafer
- Deeprobe 300A
Fully automated for 300 mm wafer
(200/300 mm available on request)
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