Fogale received multiple orders for 3D IC applications in Asia |
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Wednesday, 24 August 2011 00:00 |
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The T-MAP dual has been chosen by the institute of Micro Electronics in Singapore. A first tool has been installed in July. The T-MAP DUAL IR 3D is the perfect choice for 3D IC process control because it combines white light and infra red light microscopy with TSV and wafer thickness measurement capability. The remaining silicon thickness below TSV can also be measured with tool. The metrology IR beam is positioned below the TSV by using the IR microscopy. Other T-MAP will be delivered to key customers in September and October 2011.
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