FOGALE is a new member of the µpacks consortia |
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Friday, 04 November 2011 15:13 |
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FOGALE will join the micropacks consortia as a new member. |
Fogale received multiple orders for 3D IC applications in Asia |
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Wednesday, 24 August 2011 00:00 |
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The T-MAP dual has been chosen by the institute of Micro Electronics in Singapore. A first tool has been installed in July. The T-MAP DUAL IR 3D is the perfect choice for 3D IC process control because it combines white light and infra red light microscopy with TSV and wafer thickness measurement capability. The remaining silicon thickness below TSV can also be measured with tool. The metrology IR beam is positioned below the TSV by using the IR microscopy. Other T-MAP will be delivered to key customers in September and October 2011. |
A major equipment supplier is now using the T-MAP DUAL for GaN/Sapphire thickness measurement |
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Thursday, 30 June 2011 00:00 |
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A major MOCVD process equipment supplier is now using the T-MAP DUAL for thin film and substrate thickness measurement. The T-MAP DUAL allowed also the process development team to estimate the refractive index of the deposited layers. |
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Tuesday, 15 February 2011 00:00 |
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3D packaging Newsletter February 2011 : 3DICs test and metrology solutions by FOGALE Nanotech.
Click here to view the PDF |
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Saturday, 15 January 2011 00:00 |
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New Trends in Wafer-level Packaging of MEMS require well suited Metrology and inspection solutions.
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Wednesday, 15 December 2010 00:00 |
FOGALE Nanotech received order from a major foudry in Taiwan for its T-MAP 300. The T-MAP 300 can measure substrate thickness, TTV bow and warp for all back end applications on 200 and 300 mm wafers. The system is equipped with specific wafer and substrate holders and is using microscopy for precise measurement on defined pattern. Thanks to the best in class pattern matching device, all measurements are performed automatically with high throughput.
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Monday, 02 August 2010 15:25 |
FOGALE DEEPROBE 300 is qualified by IMEC Belgium for in line TSV process control on both 200 and 300 mm wafers. The DEEPROBE 300 installed in IMEC facility is now a part of the process flow for the 3D integration program.
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Wednesday, 16 June 2010 12:56 |
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FOGALE announces MEMSCAN orders and tool installations at customer sites |
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Wednesday, 16 June 2010 12:56 |
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New product |
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FOGALE is member of SEMI Grenoble office |
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Saturday, 12 June 2010 12:56 |
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Following the integration of Jemi France as part of Semi, an international organization representing 2,000 firms (of which 11% are located in Europe), FOGALE Nanotech is now member of SEMI Europe. |
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Thursday, 10 June 2010 16:10 |
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FOGALE announces a joint development program with IMEC (Belgium) for TSV measurement on 200 and 300 mm wafers with the Deeprobe 300 M. |
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Tuesday, 01 June 2010 10:10 |
FOGALE is involved in the SMARTSTACK project with LETI and ST micro.
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