Semiconductor
Metrology Solutions
- Wafer Surface Metrology
- Via Depth
- Membrane Thickness
- Non-contact Surface profilometry,
- Roughness measurement,
- MEMS,
- Bumps dimensions,
- Film Thickness,
- Step Heigth, cavities.
- Wafer Dimensional Metrology
- Multilayer Substrate Control
- Thickness, TTV, Bow, Warp measurement,
- Wafer Characterization,
- Layer thickness measurement,
- Ultrathin wafer substrates.
- PHOTONICS WEST
24 - 29 January 2009 - CMOI
20 november 2008 - Semicon Europa
08 october 2008 - MESUREXPO
30 september 2008 - Semicon West
15 july 2008 - Interconex
24 june 2008 - FOGALE nanotech announces new line of surface & dimensional metrology products
- FOGALE nanotech: 25 years of innovation in metrology
FOGALE nanotech
France +33(0)4 66 62 05 55
info@fogale.com
FOGALE nanotech Inc,
San Francisco, CA +1(818) 206-8525
usa@fogale.com
3D Profilers Series
Non Contact Dimensional Metrology for Substrate Control
Via and Trench Depth
Membrane Thickness OEM
Membrane Thickness OEM