Substrate Non Contact
Dimensional Control


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DeeProbe
DeeProbe uses the first cost effective, nondestructive optical method for micromachining process control.
DeeProbe allows customers to improve both yield and process control for Deep Reactive Ion Etching, Laser drill and surface micromachining processes.

  
T-POINT
  • Non-Contact Optical Metrology Solution for Thickness, TTV, Bow and Warp Measurements
  • • Substrate Thickness
  • • Multi layer Thickness (>3µm)
  • • Surface Flatness
  • Main Features:
  • • Small footprint
  • • Ajustable handling device depending on wafer size
  • • Up to 300mm and samples shape
  • • Fast and easy to use
  • • Provides real times measurement
  • • Adaptable sample holder
  • • Small spot size available
  • • Calibration and maintenance free


  
T-MAP Series
  • Non contact measurement:
  • • Substrate thickness
  • • Multilayers thickness (>3µm)
  • • Bow & Warp
  • • Surface flatness
  • • Individual thickness layer of stack
  • • Roughness measurement
  • Key features:
  • • Full auto measurement sequences
  • • Small footprint and clean room compatibility
  • • Manual loading / 200mm and 300mm auto load tools
  • • Fast and easy to use in both engineering and operator mode
  • • Provides 2D and 3D mapping of substrate shape
  • • Real time signal shape analysis to deliver best in class results
  • • Quality factor calculation to avoid false measurement and detect   100% out of spec measurement
  • • Sample holders easy to exchange
  • • Small spot size available


  
T-MAP IR
The T-MAP IR relies on the measurement principe of low coherence interferometry. The Optical probe directs the 1310 nm IR light though the substrate materiel and send back the light reflected by each layer interface to the control module. MEMS membrane thickness measurement.
Thickness, bow, warp and individual thickness of stacked layers measurement for all kind of substrate without metal coating materials.
T-MAP Chromatic
It uses the principe of chromatic coding (variation of the refractive index as a function of wavelength) to measure the sample position in the measurement range. T-MAP Chromatic is equipped with 2 sensors, one on each side of the substrate, to measure position of each point on front and backside of substrates.
Thickness, bow, warp and surface roughness measurement for all kind of substrate regardless of coating materials.
T-MAP Dual
T-MAP Dual is equipped with both White light chromatic and IR sensors and controllers. Il provides full flexibility for the user in selecting the best method of measurement in reference to the type of wafers and type of materials to measure and also provides the highest measurement accuracy.
Thickness, bow, warp and individual thickness of stacked layers measurement for all kind of substrate.