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Microsurf 3D & kit M3D
Enhanced microscope for fast and precise 3D measurement.
Table-top system perfect for R&D use.
Cost effective entry level 3D profiler.
 
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Photomap 3D
Solution for 3D surface topography on Wafer up to 200 mm diameter.
System driver features:
• Motorized Z-axis for easy measurement setting built-in motorized zoom.
• Red and white light sources with tuable source level.
MEMS solution available.
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Zoomsurf 3D
Industrial Z-axis motorized system for caracterization of large samples.
Fully automatic:
• Auto-focus
• Stitching of fields of view
• Automatic measurement sequences configurable by the user
MEMS solution available.
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Cybersurf 3D
The ultimate solution for fully automated control on Silicon wafers.
• Automatic wafer load / unload
• 6" and 8" wafers, 12" on request
• Auto wafer alignment
• Semi-automatic measurement sequence:
- - Start up to 25 wafer measurement in a single operation
- - Pattern dimensions (Bimp width/lenght/height,photoresit aperture size)
- - Step height, and transparent film thickness
- - Bump roughness
• Custom report format:
- - Excel or text result output or html
- - Display min/max, coplanarity, in spec/out of spec
- - Result suitable for chip per chip, wafer per wafer, cassette per cassette analysis
- - Temporal process evolution
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MEMS Options
Vibrometric measurement capability:
- • Direct observation of MEMS in motion
- • Real time mode shape measurement for membranes
- • Stroboscopic deformed shape measurement
- • Automatic stroboscopic full field phase and amplitude vibration measurement
- • Amplitude vs frequency or amplitude vs time measurement
- • Vibration spectrum with no frequency limitation
An Option for FOGALE profilers enabling stroboscopic measurement with nanometer accuracy:
- • Available for the Photomap 3D profilers
- • Fully integrated into electronic module of FOGALE profilers
- • Software control
- • Frequency range from 100Hz to 3MHz
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Vacuum Box
- • Stroboscopic interferometric microscopy combined with vacuum box is the perfect tool for MEMS testing,mechanical measurements, and MEMS behaviour testing under temperature.
- • Device characterization under controlled environnemental conditions:
- - Vacuum
- - Gaz partial pressure
- - Temperature
- • Fogale developped specific glass-compensated, long-working distance, interferometric objectives for 3D mode shape measurement across the vacuum box glass plate:
- - MEMS BOX
- - Probe application
- - Measurement accross glass/transparence film
- • MEMS Solution: High performance software for In-plane and out-of-plane dynamic measurement
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Pressure Box
- • Pressure device stratic & dynamic characterization for M(O)EMS and material testing
- • Pressure range: 1 to 3.5 Bars
- • Wafer size up to 8 inch
- • XY stage motorized
- • Specifics functions
- • Available for Zoomsurf 3D and Photomap 3D
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