ALL PRODUCTS
> ALL PRODUCTS:
- 3D Profiler Series:
- Microsurf 3D
- Photomap 3D
- Zoomsurf 3D
- Cybersurf 3D
- MEMS options
- Environmental chambers
- - Vacuum Box
- - Pressure Box
- Non contact dimensional metrology for substrate control:
- T-POINT
- T-MAP Series
- - T-MAP IR
- - T-MAP Chromatic
- - T-MAP Dual
- Via and trench depth membrane thickness:
- DeeProbe
3D Profilers
3D Surface Metrology, Roughness, Film Thickness, MEMS in Motion, Step height.
The Optical Profilers supplied by FOGALE nanotech are renowned
world-wide for dealing with surfaces that are difficult to measure because of important roughness
or on the contrary extreme smoothness, because of rapidly moving parts, because of low or high sample reflectivity...
Non Contact Dimensional Metrology for Substrate Control
Non-contact optical metrology solution for Thickness, TTV, Bow and Warp measurement.
FOGALE nanotech provides single or multi sensor technologies depending on customer applications.
The T-MAP platform allows customers to upgrade their metrology tools as applications evolve.
Whether customers need stand alone manual wafer loading tools or fully integrated systems with SECS/GEM interface for the production floor.
Via and Trench depth Membrane thickness
The non contact metrology solution for Deep high aspect ratio Via depth and membrane thickness control
OEM
FOGALE nanotech provides very compact OEM solutions for integrated/embedded metrology