FOGALE nanotech - Semiconductor Metrology Solutions - Packaging & Interconnect

Packaging
& Interconnect

> Packaging & Interconnect

DeeProbe
Microsurf 3D
Photomap 3D
Zoomsurf 3D
Cybersurf 3D
T-POINT
T-MAP Series
- T-MAP IR
- T-MAP Chromatic
- T-MAP Dual

	DeeProbe DeeProbe uses the first cost effective, nondestructive optical method for micromachining process control. DeeProbe allows customers to improve both yield and process control for Deep Reactive Ion Etching, Laser drill and surface micromachining processes.
	Microsurf 3D & kit M3D Enhanced microscope for fast and precise 3D measurement. Table-top system perfect for R&D use. Cost effective entry level 3D profiler.
	Photomap 3D Solution for 3D surface topography on Wafer up to 200 mm diameter. System driver features: • Motorized Z-axis for easy measurement setting built-in motorized zoom. • Red and white light sources with tuable source level. MEMS solution available.
	Zoomsurf 3D Industrial Z-axis motorized system for caracterization of large samples. Fully automatic: • Auto-focus • Stitching of fields of view • Automatic measurement sequences configurable by the user MEMS solution available.
	Cybersurf 3D The ultimate solution for fully automated control on Silicon wafers. • Automatic wafer load / unload • 6" and 8" wafers, 12" on request • Auto wafer alignment • Semi-automatic measurement sequence: - Start up to 25 wafer measurement in a single operation - Pattern dimensions (Bimp width/lenght/height,photoresit aperture size) - Step height, and transparent film thickness - Bump roughness • Custom report format: - Excel or text result output or html - Display min/max, coplanarity, in spec/out of spec - Result suitable for chip per chip, wafer per wafer, cassette per cassette analysis - Temporal process evolution
	T-POINT Non-Contact Optical Metrology Solution for Thickness, TTV, Bow and Warp Measurements • Substrate Thickness • Multi layer Thickness (>3µm) • Surface Flatness Main Features: • Small footprint • Ajustable handling device depending on wafer size • Up to 300mm and samples shape • Fast and easy to use • Provides real times measurement • Adaptable sample holder • Small spot size available • Calibration and maintenance free
	T-MAP Series Non contact measurement: • Substrate thickness • Multilayers thickness (>3µm) • Bow & Warp • Surface flatness • Individual thickness layer of stack • Roughness measurement Key features: • Full auto measurement sequences • Small footprint and clean room compatibility • Manual loading / 200mm and 300mm auto load tools • Fast and easy to use in both engineering and operator mode • Provides 2D and 3D mapping of substrate shape • Real time signal shape analysis to deliver best in class results • Quality factor calculation to avoid false measurement and detect 100% out of spec measurement • Sample holders easy to exchange • Small spot size available
	T-MAP IR The T-MAP IR relies on the measurement principe of low coherence interferometry. The Optical probe directs the 1310 nm IR light though the substrate materiel and send back the light reflected by each layer interface to the control module. MEMS membrane thickness measurement. Thickness, bow, warp and individual thickness of stacked layers measurement for all kind of substrate without metal coating materials.
	T-MAP Chromatic It uses the principe of chromatic coding (variation of the refractive index as a function of wavelength) to measure the sample position in the measurement range. T-MAP Chromatic is equipped with 2 sensors, one on each side of the substrate, to measure position of each point on front and backside of substrates. Thickness, bow, warp and surface roughness measurement for all kind of substrate regardless of coating materials.
	T-MAP Dual T-MAP Dual is equipped with both White light chromatic and IR sensors and controllers. Il provides full flexibility for the user in selecting the best method of measurement in reference to the type of wafers and type of materials to measure and also provides the highest measurement accuracy. Thickness, bow, warp and individual thickness of stacked layers measurement for all kind of substrate.