MEMS
and 3D Integration


> ALL PRODUCTS
DeeProbe
DeeProbe uses the first cost effective, nondestructive optical method for micromachining process control.
DeeProbe allows customers to improve both yield and process control for Deep Reactive Ion Etching, Laser drill and surface micromachining processes.

  
Microsurf 3D & kit M3D
Enhanced microscope for fast and precise 3D measurement.
Table-top system perfect for R&D use.
Cost effective entry level 3D profiler.

  
Photomap 3D
Solution for 3D surface topography on Wafer up to 200 mm diameter.
System driver features:
• Motorized Z-axis for easy measurement setting built-in motorized   zoom.
• Red and white light sources with tuable source level.

MEMS solution available.

  
Zoomsurf 3D
Industrial Z-axis motorized system for caracterization of large samples.
Fully automatic:
• Auto-focus
• Stitching of fields of view
• Automatic measurement sequences configurable by the user

MEMS solution available.

  
Cybersurf 3D
The ultimate solution for fully automated control on Silicon wafers.
• Automatic wafer load / unload
• 6" and 8" wafers, 12" on request
• Auto wafer alignment

• Semi-automatic measurement sequence:
  • - Start up to 25 wafer measurement in a single operation
  • - Pattern dimensions (Bimp width/lenght/height,photoresit aperture    size)
  • - Step height, and transparent film thickness
  • - Bump roughness

• Custom report format:
  • - Excel or text result output or html
  • - Display min/max, coplanarity, in spec/out of spec
  • - Result suitable for chip per chip, wafer per wafer, cassette per    cassette analysis
  • - Temporal process evolution


  
MEMS Options
Vibrometric measurement capability:
  • • Direct observation of MEMS in motion
  • • Real time mode shape measurement for membranes
  • • Stroboscopic deformed shape measurement
  • • Automatic stroboscopic full field phase and amplitude vibration   measurement
  • • Amplitude vs frequency or amplitude vs time measurement
  • • Vibration spectrum with no frequency limitation

An Option for FOGALE profilers enabling stroboscopic measurement with nanometer accuracy:
  • • Available for the Photomap 3D profilers
  • • Fully integrated into electronic module of FOGALE profilers
  • • Software control
  • • Frequency range from 100Hz to 3MHz


  
Vacuum Box
  • • Stroboscopic interferometric microscopy combined with vacuum box is the perfect tool for MEMS testing,mechanical measurements, and MEMS behaviour testing under temperature.
  • • Device characterization under controlled environnemental conditions:
  • - Vacuum
  • - Gaz partial pressure
  • - Temperature
  • • Fogale developped specific glass-compensated, long-working distance, interferometric objectives for 3D mode shape measurement across the vacuum box glass plate:
  • - MEMS BOX
  • - Probe application
  • - Measurement accross glass/transparence film
  • • MEMS Solution: High performance software for In-plane and out-of-plane dynamic measurement


  
Pressure Box
  • • Pressure device stratic & dynamic characterization for M(O)EMS   and material testing
  • • Pressure range: 1 to 3.5 Bars
  • • Wafer size up to 8 inch
  • • XY stage motorized
  • • Specifics functions
  • • Available for Zoomsurf 3D and Photomap 3D