3D Architectures for semiconductor

December 12-14, 2011

http://techventure.rti.org/speakers.html

FOGALE Presentation: 12 December 2011

Process Integration and Process Control Solutions for 3-D System in Package-based on TSV and Micro-insert Interconnections for SmartCard Application

Gilles Fresquet
Semiconductor Division Manager
FOGALE nanotech 

• Process steps description for multi chip (micro controller/memory) 3-D stacking
• Performance analysis of test vehicle based on TSV technology for SmartCard applications
• Metrology and process control solutions for 3-D stacking (via middle and via last)