3D Architectures for semiconductor |
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December 12-14, 2011
http://techventure.rti.org/speakers.html
FOGALE Presentation: 12 December 2011
Process Integration and Process Control Solutions for 3-D System in Package-based on TSV and Micro-insert Interconnections for SmartCard Application
Gilles Fresquet
Semiconductor Division Manager
FOGALE nanotech
• Process steps description for multi chip (micro controller/memory) 3-D stacking
• Performance analysis of test vehicle based on TSV technology for SmartCard applications
• Metrology and process control solutions for 3-D stacking (via middle and via last) |
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