Products

T-MAP DUAL 3D

t-map-dual-3d

T-MAP DUAL 3D: Full process control solution

TSV dimensionnal Control

Qualified and certified by IMEC

Temporary bonding

  • TTV
  • Glue
  • Bow Void detection

Wafer Thinning

  • TTV
  • Glue TTV
  • Bow
  • Void in glue detection
  • nm level roughness
  • Crack detection
  • Edge trim dimensions

TSV reveal

  • Copper nails height and coplanarity
  • Bonding

  • Overlay registration
  • Micro bump

  • height and coplanarity
  • RDL

  • dimensions
  • MEMS

  • In plane and out of the plane registration
  • Debonding

  • Inspection
  • Thin film

  • thickness
  • RDL
  • Tool configurations

    • T-MAP DUAL 3D 200M & 300M: manual loading
    • T-MAP DUAL 3D 200A: Fully automated up to 200mm
    • T-MAP DUAL 3D 300A: 300mm fully automated

    Note: Metrology and Inspection for wafer on dicing frame available