FOGALE nanotech, an engineering company created in 1983, is now a worldwide known reference in the field of high accuracy dimensional metrology. FOGALE nanotech provides process control and characterization solutions for MEMS and semiconductor manufacturers and labs around the world. FOGALE nanotech is a member of SEMI organization.
FOGALE Headquarter is located in NÎMES, south of France.
With a high level of expertise in optical and capacitive metrology and a strong scientific background, FOGALE nanotech provides standard and customized systems well suited to new metrology requirements for the following applications:
- 3D integration: wafer on temporary carrier dimensional control
- 3D integration: High Aspect ratio TSV measurement
- Substrate: mono and multi layer substrate dimensional control
- MEMS: Bulk and surface micromachining process control and defect inspection
- MEMS: 3D surface profiler, dynamic measurement, measurement under controlled atmosphere
- MEMS: Deep high aspect ratio Via and Trench dimensional measurement
By using constructive risk analysis approach though our design and tool development activities ensure us to provide quick and reliable solutions to customer.
- Continuous improvement approach based on root cause identification and lessons learned from our day to day activities is deployed systematically inside our company. Use of FMEA approach to develop robust solutions.
- Development of quality supplier performance with permanent cooperation is the key to get best results by using preventive quality methods and tools.
- Partnership with key players and semiconductor laboratories through federative labs and Joint Development program.
- Development of partnership with the main players involved in MEMS and semiconductor quality supplier performance with permanent cooperation is the key to get best results by using preventive quality methods and tools.
FOGALE nanotech 125 rue de l'hostellerie - Bât A 30900 NIMES - FRANCE
Tel: +33(0) 466 620 555 / Fax: +33(0) 466 627 160