Back-end applications

  • Interconnect 3D topography and Bumps dimensional control
  • Wafer thinning process control: Thickness/TTV/backside roughness measurement
  • 3D surface topography is required for quality control in back-end applications.
    Bump dimensional control (height, width, angle of curvature, coplanarity) cannot be avoided to qualify the interconnect process steps.

  • Related products - 3D Profilers

    Related Products - T-MAP