Interconnect 3D topography and Bumps dimensional control
Wafer thinning process control: Thickness/TTV/backside roughness measurement
3D surface topography is required for quality control in back-end applications.
Bump dimensional control (height, width, angle of curvature, coplanarity) cannot be avoided to qualify the interconnect process steps.
Related products - 3D Profilers
Related Products - T-MAP