FOGALE DUAL 3D: New success

T-MAP DUAL 3D 300A was elected  2014 best Metrology/Inspection tool for 3D applications and received the 3D Incites Award
 
 
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Non-contact metrology is essential for device characterization and process control. The use of multi layer substrates, very thin wafers, high aspect ratio TSV for 3D integration, and the development of new MEMS devices require advanced 3D dimensional metrology solutions. With a high level of expertise in optical metrology and a strong scientific background, FOGALE nanotech provides standard and customized systems well suited to new metrology requirements for MEMS and semiconductor applications.

 

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