On June 17-18 2015
San Franciscoon July 14-16
EMRS conference in Strasbourg
FOGALE invites you to EMRS conference in Strasbourg on May 15th at 9h45 for Optical Characterization and Defect inspection for 3D stacked IC technology.
Minapad 2015 Grenoble
April 22 23, 2015 IMAPS-France Micro/Nano-electronics Packaging and Assembly, Design and manufacturing Forum.
3D European Summit
January 20-21, 2015
SEMI Europe is proud to announce the 3rd edition of the European 3D TSV Summit. The event will be held on January 19-21, 2015 in Grenoble (France).
Non-contact metrology is essential for device characterization and process control. The use of multi layer substrates, very thin wafers, high aspect ratio TSV for 3D integration, and the development of new MEMS devices require advanced 3D dimensional metrology solutions. With a high level of expertise in optical metrology and a strong scientific background, FOGALE nanotech provides standard and customized systems well suited to new metrology requirements for MEMS and semiconductor applications.
TSV in line process control Wafer thinning: Thickness, TTV, RST, Edge trim, bow, warp and roughness measurements for wafer on temporary carrier, TSV reveal, defect review… all in one tool with FOGALE patented optical head.
Complete 3D dimensional metrology and inspection solution for MEMS analysis: 3D profile and high Aspect ratio Via and Trench depth measurement, Dynamic analysis of MEMS in motion, Membrane and Air gap thickness measurement, Wafer Level packaging process control, Bulk and surface micromachining process control.
Tchickness, TTV and shape for all kind of materials: Si, SOI, GaN, Sapphire, AsGA, Glass, Patterned wafers…